| Serial number |
Project |
Technical indicator |
| 1 |
Layer counting |
2-20 (layer) |
| 2 |
Process
the area the most largly |
550 x 1000mm
|
| 3 |
The minimum board is
thick |
4
(layer) 0.40mm |
| 6 (layer) 0.80mm
|
| 8
(layer) 1.00mm |
| 10 (layer) 1.20mm
|
| 4 |
The minimum line is wide
|
0.10mm |
| 5 |
Minimum interval |
0.10mm |
| 6 |
Minimum aperture |
0.20mm |
| 7 |
The hole and wall copper
are thick |
0.025mm |
| 8 |
Metallization aperture
public errand |
¡À 0.08mm |
| 9 |
It is not a metallization
aperture public errand |
¡À 0.025mm |
| 10 |
Hole location public
errand |
¡À 0.05mm |
| 11 |
Appearance dimensional
tolerance |
¡À 0.1mm |
| 12 |
Weld the bridge minimumly
|
0.10mm |
| 13 |
Insulating resistance
|
1E +12¦¸ (normality ) |
| 14 |
Board thick aperture
than |
10 : 1
|
| 15 |
Hot impact |
288
point 20 degrees Centigrade (second) |
| 16 |
Twist and crooked |
¡Ü 0.7% |
| 17 |
Resist the electric intensity
|
>1.3KV/mm |
| 18 |
Resist the intensity
of stripping |
1.4N/mm |
| 19 |
Hinder the intensity
of the solder flux |
>6H |
| 20 |
Fire-retardant |
94V-0 |
| 21 |
Impedance controlling
|
¡À 5% |
